| MRC | Criteria | Characteristic |
|---|---|---|
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
| ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL |
| ADAQ | BODY LENGTH | 0.135 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.130 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.058 INCHES MINIMUM AND 0.102 INCHES MAXIMUM |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| AGAV | END ITEM IDENTIFICATION | PACER DAWN |
| CQBQ | CAPACITANCE VALUE PER SECTION | 4.300 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQLZ | III TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 90.0 SINGLE SECTION |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 500.0 DC SINGLE SECTION |
| CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -20.0/+20.0 SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -0.10/+0.10 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
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